Broadcom洽谈融资700亿至800亿美元债务用于芯片融资
1 independent sourcefirst seen published latency 13 min
据CNBC报道，Broadcom正洽谈融资700亿至800亿美元债务用于芯片融资交易。该公司正探索债务市场以资助一项未经公开的收购或半导体制造或技术领域的投资。
Sources: CNBC
本文仅供参考，不构成财务建议。
标签： Broadcom, debt, semiconductor
Cite this
Archived copy · an independent capture of this page at the Internet Archive, kept so this report can be checked against what it said on the day
← 更多 Byte